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Investigation of Z-type manifold microchannel cooling for... | ResearchHub
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Investigation of Z-type manifold microchannel cooling for ultra-high heat flux dissipation in power electronic devices
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Authors
Shuiqing Yang
•
Junye Li
2 more
•
Kuang Sheng
Published
January 1, 2024
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Journal
International Journal of Heat and Mass Transfer
Topics
Materials Science
Physics
Materials Science
Engineering
Mechanical Engineering
Coolant
Show all topics
DOI
https://doi.org/10.1016/j.ijheatmasstransfer.2023.124792
