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Photonic Chiplet Interconnection via 3D-Nanoprinted Inter... | ResearchHub
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Photonic Chiplet Interconnection via 3D-Nanoprinted Interposer
8
Authors
Hui‐Yu Huang
•
Zhitian Shi
3 more
•
Qixiang Cheng
Published
February 19, 2024
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Journal
arXiv (Cornell University)
Topics
Materials Science
Computer Science
Materials Science
Telecommunications
Interposer
Optoelectronics
Show all topics
DOI
10.48550/arxiv.2402.11988
Other Formats
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