Paper
Paper
Search...
Search ResearchHub...
Ctrl+K
New
Home
Browse
Earn
Fund
RH Journal
Notebook
Lists
Leaderboard
RSC
USD
Changelog
Terms
Privacy
Issues
Docs
Support
Foundation
About
Development of 0.5 μm Pixel 3-Wafers Stacked CMOS Image S... | ResearchHub
Paper
Paper
Search...
Search ResearchHub...
Ctrl+K
New
Home
Browse
Earn
Fund
RH Journal
Notebook
Lists
Leaderboard
RSC
USD
Changelog
Terms
Privacy
Issues
Docs
Support
Foundation
About
Development of 0.5 μm Pixel 3-Wafers Stacked CMOS Image Sensor with through Silicon Deep Contact and In-pixel Cu-Cu Bonding Process
0
Authors
Doyeon Kim
Published
May 28, 2024
Paper
Conversation
0
Reviews
0
Bounties
0
Sign in to comment
Add a comment...
Best
Supporters
Support the authors with ResearchCoin
Tip RSC
Topics
Computer Science
Materials Science
Artificial Intelligence
Wafer Bonding
Optoelectronics
Show all topics
DOI
10.1109/ectc51529.2024.00070
